Description:8kV HBM I/O to GND ESD (per JESD22-A114 & Mil Std 883e 3015.7) ; Bi-directional interface between any 2 levels from 1.1V to 3.6V; No power-up sequencing required; Control inputs (T/R#, OE#) levels are referenced to VCCA voltage; 4kV HBM ESD (per JESD22-A114 & Mil Std 883e 3015.7) ; Non-preferential power-up sequencing; either VCC may be powered-up first; 1kV CDM ESD (per ESD STM 5.3) ; Power-off protection; Fully configurable, inputs track VCC level; Outputs switch to 3-STATE if either VCC is at GND; 200V M
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
Ensure that the device is operated within the recommended voltage and current ratings. Also, consider the thermal derating of the device, and ensure that the junction temperature (Tj) does not exceed 150°C. Proper PCB design, thermal management, and cooling mechanisms can help achieve this.
The FXL2T245L10X has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV human body model (HBM) and 200V machine model (MM) ESD protection is recommended.
Yes, the FXL2T245L10X is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is PPAP capable. However, it's essential to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
The recommended soldering conditions are: peak temperature of 260°C, time above 217°C of 30 seconds, and a total process time of 60 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
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FXL2T245L10X Overview
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