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FXLA0104QFX - onsemi

Description: ESD Protection Exceeds:; Non-Preferential Power-Up; Either VCC May Be Powered Up First; Control Input (OE) Referenced to VCCA Voltage; 6kV HBM (per JESD22-A114 & Mil Std 883e3015.7); Bi-Directional Interface between Two Levels: from 1.1V to 3.6V; 100Mbps Throughput when Translating Between 1.8V and 2.5V; Outputs Switch to 3-State if Either VCC is at GND; Available in the 12-Lead, 1.7mm x 2.0mm UMLP Package; Bus-Hold on Data Inputs Eliminates the Need for Pull-Up Resistors; Do Not Use Pull-Up Resistors on A

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PCB Footprints
FXLA0104QFX - onsemi PCB footprint - Other - Other - FXLA0104QFX-5
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FXLA0104QFX - onsemi  - 3D model - Other - FXLA0104QFX-5
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FXLA0104QFX Details

  • Manufacturer Part Number:

    FXLA0104QFX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    UQFN-12

  • Package Description:

    UMLP-12

  • Manufacturer Package Code:

    523AE

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Delay-Max:

    9.2 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.4 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.1 V

  • Supply Voltage1-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.7 mm

FXLA0104QFX Frequently Asked Questions (FAQs)

  • A good PCB layout for the FXLA0104QFX involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The FXLA0104QFX requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator (LDO) or a switching regulator with a low output voltage ripple to power the device. Power sequencing is not critical, but it's recommended to power up the device after the input voltage has stabilized.
  • The FXLA0104QFX can handle a maximum current of 1A per channel. To calculate the power dissipation, use the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • To troubleshoot issues with the FXLA0104QFX, check the input voltage, output voltage, and output current. Verify that the device is properly powered and that the input voltage is within the recommended range. Check for overheating by measuring the device temperature. If issues persist, consult the onsemi application note AN5191 for troubleshooting guidelines.
  • Yes, the FXLA0104QFX has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB. Additionally, ensure good airflow around the device to prevent overheating.

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