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FXLN8362QR1 - NXP

Description: 3-Axis LowPower Analog-Output Accelerometer

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PCB Footprints
FXLN8362QR1 - NXP PCB footprint - Other - Other - FXLN8362QR1-4
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3D Models
FXLN8362QR1 - NXP  - 3D model - Other - FXLN8362QR1-4
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FXLN8362QR1 Details

  • Manufacturer Part Number:

    FXLN8362QR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Body Breadth:

    3 mm

  • Body Height:

    0.95 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    ANALOG

  • Output Type:

    ANALOG VOLTAGE

  • Package Body Material:

    UNSPECIFIED

  • Package Equivalence Code:

    LCC12,.12SQ,25

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    ACCELEROMETER

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

FXLN8362QR1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FXLN8362QR1 involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the loop area of the tracks to reduce EMI. It's also recommended to use a common mode choke and a shielded cable for the USB connection.
  • To ensure proper power and decoupling, connect a 10uF capacitor between VCC and GND, and a 100nF capacitor between VCC and GND near the device. Also, use a low-ESR capacitor for the 3.3V power supply and ensure the power supply can provide enough current.
  • The FXLN8362QR1 has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if the device will be operating at high temperatures or high currents.
  • The FXLN8362QR1 can be configured for different USB modes by setting the MODE pin high or low. For example, setting the MODE pin high enables USB 2.0 mode, while setting it low enables USB 1.1 mode. Consult the datasheet for specific configuration options.
  • The FXLN8362QR1 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Ensure that the device is handled in an ESD-safe environment, and consider adding external ESD protection devices if necessary.

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FXLN8362QR1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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