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FXLN8371QR1 - NXP

Description: 3-Axis LowPower Analog-Output Accelerometer

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Symbol
FXLN8371QR1 - NXP - PCB symbol
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PCB Footprints
FXLN8371QR1 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN-COL-3x3x1
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3D Models
FXLN8371QR1 - NXP - 3D model - Quad Flat No-Lead - QFN-COL-3x3x1
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FXLN8371QR1 Details

  • Manufacturer Part Number:

    FXLN8371QR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Body Breadth:

    3 mm

  • Body Height:

    0.95 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    ANALOG

  • Output Type:

    ANALOG VOLTAGE

  • Package Body Material:

    UNSPECIFIED

  • Package Equivalence Code:

    LCC12,.12SQ,25

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    ACCELEROMETER

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

FXLN8371QR1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Use a 10nF capacitor between VCC and GND, and a 1uF capacitor between VCC and AVCC.
  • Follow the power-up sequence: VCC, then AVCC, then VREF. Ensure VCC and AVCC are within 0.3V of each other. Configure the device using the SPI interface, and ensure the clock frequency is within the recommended range.
  • The recommended operating temperature range is -40°C to 125°C. However, the device can operate up to 150°C for short periods. Ensure proper thermal management to prevent overheating.
  • Use a shielded enclosure, and ensure the PCB layout is EMI-friendly. Add EMI filters and shielding to the device's inputs and outputs. Follow NXP's EMI and EMC guidelines for the FXLN8371QR1.
  • Ensure proper power supply decoupling, use a stable clock source, and implement error detection and correction mechanisms. Follow NXP's guidelines for system design and testing.

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FXLN8371QR1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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