A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power dissipation according to the datasheet's thermal derating curve.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to filter out input noise and ensure stable operation.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and consider adding a common-mode choke or EMI filter to reduce radiated emissions.
The maximum allowed voltage on the EN pin is 6V. Ensure proper startup by connecting a 1kΩ to 10kΩ pull-up resistor from EN to VIN, and a 100nF to 1uF capacitor from EN to GND.
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