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GBJ5006L-BP - MCC

Description: Bridge Rectifier Single Phase Standard 600 V Through Hole GBJ

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GBJ5006L-BP - MCC - PCB symbol
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PCB Footprints
GBJ5006L-BP - MCC PCB footprint - Other - Other - GBJ5006L-BP-1
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3D Models
GBJ5006L-BP - MCC - 3D model - Other - GBJ5006L-BP-1
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GBJ5006L-BP Details

  • Manufacturer Part Number:

    GBJ5006L-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.97 V

  • JESD-30 Code:

    R-PSFM-T4

  • Non-rep Pk Forward Current-Max:

    420 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    50 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    5

GBJ5006L-BP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the GBJ5006L-BP is a standard SOT-23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
  • Yes, the GBJ5006L-BP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • The maximum allowable power dissipation for the GBJ5006L-BP is 1.5W, assuming a maximum junction temperature of 150°C and a thermal resistance of 125°C/W.
  • Yes, the GBJ5006L-BP is compatible with lead-free soldering processes, including reflow soldering and wave soldering. However, the device's peak reflow temperature should not exceed 260°C.
  • The typical turn-on time for the GBJ5006L-BP is around 10-20ns, depending on the input signal rise time and the output load capacitance.

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GBJ5006L-BP Overview

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