The recommended PCB footprint for the GBL08E-E3/P is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
To prevent damage, handle the GBL08E-E3/P by the edges, avoid touching the component's leads or body, and use an anti-static wrist strap or mat. Also, ensure that the assembly process does not subject the component to excessive mechanical stress, such as bending or flexing.
The maximum allowable voltage derating for the GBL08E-E3/P is 80% of the rated voltage. This means that if the component is rated for 100 V, the maximum allowable voltage derating would be 80 V.
The GBL08E-E3/P is rated for operation up to 150°C. However, it's recommended to derate the component's voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a solder flux that is compatible with the component's lead finish. Also, ensure that the soldering time does not exceed 3 seconds per lead, and that the component is not subjected to excessive soldering temperatures or times.
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GBL08E-E3/P Overview
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