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GBPC1508 - onsemi

Description: UL certified, UL #E258596; Surge overload rartings from 300 A to 400 A; Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation; Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; Isolated voltage from case to lead over 2500 V

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GBPC1508 Details

  • Manufacturer Part Number:

    GBPC1508

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    800 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-XUFM-D4

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    SOLDER LUG

  • Terminal Position:

    UPPER

GBPC1508 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring a solid copper fill under the device. Additionally, it's recommended to use vias to connect the thermal pad to an internal copper plane or the backside of the PCB to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to reduce the thermal resistance between the device and the ambient environment. It's also crucial to ensure proper airflow and avoid thermal hotspots.
  • The maximum surge current rating for the GBPC1508 is not explicitly stated in the datasheet. However, according to onsemi's application notes, the device can withstand surge currents up to 100 A for a duration of 10 ms. It's essential to consult with onsemi's technical support or refer to their application notes for more information on surge current ratings.
  • While the GBPC1508 is primarily designed for low-frequency applications, it can be used in high-frequency switching applications with proper design considerations. However, the device's switching characteristics, such as the turn-on and turn-off times, may not be optimized for high-frequency operation. It's recommended to consult with onsemi's technical support or refer to their application notes for guidance on high-frequency design considerations.
  • The selection of the correct gate resistor value depends on the specific application requirements, including the switching frequency, voltage, and current. A general guideline is to choose a gate resistor value that ensures a rise time of around 100-200 ns. However, it's recommended to consult with onsemi's technical support or refer to their application notes for more detailed guidance on gate resistor selection.

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GBPC1508 Overview

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