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GBPC2502W - onsemi

Description: Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; UL certified, UL #E258596; Isolated voltage from case to lead over 2500 V; Surge overload rartings from 300 A to 400 A; Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation

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GBPC2502W - onsemi PCB footprint - Other - Other - GBPC-W
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GBPC2502W Details

  • Manufacturer Part Number:

    GBPC2502W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-PUFM-W4

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC2502W Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink if necessary, and ensure good airflow around the device. Also, follow the recommended PCB layout and thermal design guidelines.
  • The maximum allowable voltage on the gate pin is ±20V. Exceeding this voltage may damage the device.
  • Yes, the GBPC2502W is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly snubbed and that the PCB layout is optimized for high-frequency operation.
  • Handle the device by the body, not the leads. Use an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Also, use ESD-sensitive packaging and follow proper storage and handling procedures.

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GBPC2502W Overview

Use the download button to access the GBPC2502W schematic symbol and PCB footprint.
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