Description:UL certified, UL #E258596; Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation; Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; Isolated voltage from case to lead over 2500 V; Surge overload rartings from 300 A to 400 A
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures (above 85°C).
The GBPC2504 can withstand surge currents up to 100A for 10ms, but this may vary depending on the specific application and PCB design. Consult onsemi's application notes for more information.
Yes, but be aware that the device's switching performance may degrade at high frequencies (>100kHz). Ensure proper PCB layout, decoupling, and filtering to minimize EMI and ringing.
Use a TVS diode or a zener diode for overvoltage protection, and consider adding a current-sensing resistor and a fuse or PTC resettable fuse for overcurrent protection.
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GBPC2504 Overview
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