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GBU2008-BP - MCC

Description: 20A Single phase Glass passivated bridge rectifier 800 V, package GBU

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PCB Footprints
GBU2008-BP - MCC PCB footprint - Other - Other - GBU_AD
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3D Models
GBU2008-BP - MCC  - 3D model - Other - GBU_AD
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GBU2008-BP Details

  • Manufacturer Part Number:

    GBU2008-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    800 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

GBU2008-BP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the GBU2008-BP is a rectangular pad with dimensions of 1.3mm x 0.8mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive force or heat, which can damage the component.
  • The maximum operating temperature range for the GBU2008-BP is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • Yes, the GBU2008-BP is suitable for high-frequency applications up to 1 GHz, but it's essential to follow proper PCB layout and design guidelines to minimize parasitic inductance and capacitance.
  • The GBU2008-BP has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing, such as using an ESD wrist strap or mat.

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GBU2008-BP Overview

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