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GBU2504-G - Comchip Technology

Description: Bridge Rectifiers GBU GPP 25A 400V Rect. Bridge Diode

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GBU2504-G - Comchip Technology - PCB symbol
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PCB Footprints
GBU2504-G - Comchip Technology PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - GBU
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GBU2504-G - Comchip Technology - 3D model - Transistor Outline, Vertical - GBU
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GBU2504-G Details

  • Manufacturer Part Number:

    GBU2504-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-T4

  • Non-rep Pk Forward Current-Max:

    350 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBU2504-G Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is 250°C to 260°C, and the soldering time should not exceed 2 seconds to 3 seconds.
  • While the GBU2504-G is suitable for general-purpose rectification, it's not recommended for high-frequency applications (>1 kHz) due to its relatively high reverse recovery time (trr) of 3 μs.
  • Ensure good thermal contact between the device and a heat sink or PCB with a thermal pad. The recommended thermal resistance (RθJA) is ≤ 20°C/W. Use a thermal interface material if necessary.
  • The maximum allowable voltage transient is 2.5 times the rated voltage (2500 V) for a duration of ≤ 10 μs. Exceeding this may cause device failure.
  • While possible, it's not recommended due to the device's relatively high forward voltage drop (Vf) of 1.1 V, which may lead to increased power losses and reduced efficiency.

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GBU2504-G Overview

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