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GBU4D - onsemi

Description: Ideal for Printed Circuit Bboard; Surge Overload Rating: 150 A peak; UL certified, UL #E258596; Reliable Low-Cost Construction Utilizing Molded Plastic Technique; Glass-Passivated Junction

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PCB Footprints
GBU4D - onsemi PCB footprint - Other - Other - SIP4 22.05x18.55 CASE 127EL ISSUE O_2024
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3D Models
GBU4D - onsemi  - 3D model - Other - SIP4 22.05x18.55 CASE 127EL ISSUE O_2024
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GBU4D Details

  • Manufacturer Part Number:

    GBU4D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SIP-4

  • Manufacturer Package Code:

    127EL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Packing Method:

    RAIL

  • Power Dissipation-Max:

    8 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

GBU4D Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize electromagnetic interference (EMI).
  • Ensure good thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the device and the heat sink, and follow the recommended operating temperature range of -40°C to 150°C.
  • The GBU4D has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the GBU4D is suitable for high-reliability and aerospace applications. However, it's essential to follow the recommended qualification and testing procedures outlined in the onsemi documentation and relevant industry standards.
  • Use a systematic approach to troubleshoot issues, starting with a review of the PCB layout, component selection, and assembly quality. Check for signs of overheating, electrical overstress, or ESD damage. Consult the onsemi documentation and application notes for guidance on troubleshooting and failure analysis.

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GBU4D Overview

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