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GBU805 - Taiwan Semiconductor

Description: TAIWAN SEMICONDUCTOR - GBU805 - BRIDGE RECTIFIER, 8A, 600V

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GBU805 - Taiwan Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - GBU
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GBU805 - Taiwan Semiconductor  - 3D model - Transistor Outline, Vertical - GBU
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GBU805 Details

  • Manufacturer Part Number:

    GBU805

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    6.85

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

GBU805 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the GBU805 package, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the temperature and implement thermal protection mechanisms.
  • The recommended soldering conditions for the GBU805 include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering iron temperature of 350-400°C. It's also important to use a solder with a melting point above 217°C and to follow the recommended soldering profile.
  • To handle ESD protection for the GBU805, it's recommended to follow proper ESD handling procedures, use ESD-protected workstations, and implement ESD protection devices such as TVS diodes or ESD arrays on the PCB. Additionally, ensure that the device is stored in an ESD-protected package during transportation and storage.
  • The recommended input and output capacitors for the GBU805 depend on the specific application and operating conditions. However, as a general guideline, use low-ESR capacitors with a value of 10-22uF for the input capacitor and 10-47uF for the output capacitor. The capacitor voltage rating should be at least 1.5 times the maximum input voltage.

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GBU805 Overview

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