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GC50MPS12-247 - GeneSiC Semiconductor

Description: Schottky Diodes & Rectifiers 1200V 50A TO-247-2 SiC Schottky MPS

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Symbol
GC50MPS12-247 - GeneSiC Semiconductor - PCB symbol
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PCB Footprints
GC50MPS12-247 - GeneSiC Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - GC20MPS12-247
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3D Models
GC50MPS12-247 - GeneSiC Semiconductor - 3D model - Transistor Outline, Vertical - GC20MPS12-247
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GC50MPS12-247 Details

  • Manufacturer Part Number:

    GC50MPS12-247

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-247-2

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    GeneSic Semiconductor Inc

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    90 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    510 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    20 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

GC50MPS12-247 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended thermal design guidelines. Also, consider derating the device's current rating at high temperatures.
  • A gate drive voltage of 10-15V and a current of 1-2A is recommended for optimal switching performance. However, the exact values may vary depending on the specific application and PCB layout.
  • Use a TVS diode or a zener diode for overvoltage protection, and a fuse or a current sense resistor for overcurrent protection. Also, consider using a gate drive circuit with built-in overcurrent protection.
  • A dead time of 100-200ns is recommended to ensure proper switching and to prevent shoot-through currents. However, the exact value may vary depending on the specific application and PCB layout.

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GC50MPS12-247 Overview

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