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GD02MPS12E - GeneSiC Semiconductor

Description: Schottky Diodes & Rectifiers 1200V 2A TO-252-2 SiC Schottky MPS

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GD02MPS12E - GeneSiC Semiconductor - PCB symbol
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PCB Footprints
GD02MPS12E - GeneSiC Semiconductor PCB footprint - Other - Other - TO-252-2mm
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3D Models
GD02MPS12E - GeneSiC Semiconductor - 3D model - Other - TO-252-2mm
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GD02MPS12E Details

  • Manufacturer Part Number:

    GD02MPS12E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    GeneSic Semiconductor Inc

  • YTEOL:

    7

  • Additional Feature:

    FREE WHEELING DIODE, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    16 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    65 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

GD02MPS12E Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal via array under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan. Monitor junction temperature and adjust the system design accordingly.
  • Use a gate driver with a high current capability (>1A) and a low output impedance (<10 ohms). Ensure the driver is compatible with the device's gate-source voltage rating.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits. Use a voltage supervisor or a dedicated OVP IC, and consider adding a current sense resistor with a comparator or a dedicated OCP IC.
  • Use ESD protection diodes (e.g., TVS or ESD arrays) on the input and output pins. Ensure the device is handled and stored in an ESD-safe environment, and follow proper ESD handling procedures.

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GD02MPS12E Overview

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