GD10MPS12E footprint, schematic symbol and 3D model by GeneSiC Semiconductor

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PCB Footprints

GD10MPS12E - GeneSiC Semiconductor PCB footprint - Other - Other - GD10MPS12E-2

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Datasheet Download Datasheet
Stock & Prices Price & Stock for GD10MPS12E
Part Number GD10MPS12E
Manufacturer GeneSiC Semiconductor
Pin Count 3
Part Category Schottky Diode
Package Category Other
Footprint Name Other - GD10MPS12E-2
Released Date Apr 2, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

GD10MPS12E Details

Manufacturer Part Number:
GD10MPS12E
Rohs Code:
Yes
Part Life Cycle Code:
Transferred
Country Of Origin:
USA
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
GeneSic Semiconductor Inc
YTEOL:
7
Additional Feature:
FREE WHEELING DIODE, PD-CASE
Application:
EFFICIENCY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON CARBIDE
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.8 V
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
Non-rep Pk Forward Current-Max:
80 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
26 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Power Dissipation-Max:
198 W
Rep Pk Reverse Voltage-Max:
1200 V
Reverse Current-Max:
10 µA
Reverse Test Voltage:
1200 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Form:
GULL WING
Terminal Position:
SINGLE

GD10MPS12E Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended PCB layout guidelines. Also, consider using a thermal interface material (TIM) between the device and the heat sink.
The maximum allowed voltage transient on Vds is 20% above the maximum rated Vds, but it should not exceed 120% of the maximum rated Vds for more than 10ms.
Use an ESD wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die. Also, ensure that the PCB and assembly process follow ESD-safe practices.
The recommended gate drive voltage is 10-15V, and the recommended gate drive current is 1-2A. However, the optimal values may vary depending on the specific application and switching frequency.

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