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GD2X50MPS12N - GeneSiC Semiconductor

Description: Schottky Diodes & Rectifiers 1200V 100A SOT-227 SiC Schottky MPS

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GD2X50MPS12N Details

  • Manufacturer Part Number:

    GD2X50MPS12N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SOT-227, 4 PIN

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    GeneSic Semiconductor Inc

  • YTEOL:

    6

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JESD-30 Code:

    R-PUFM-X4

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    76 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    566 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    15 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

GD2X50MPS12N Frequently Asked Questions (FAQs)

  • GeneSic Semiconductor provides a reference design guide and thermal management application note that can be requested from their technical support team. It's essential to follow their guidelines for PCB layout, thermal pad design, and heat sink attachment to ensure optimal performance and reliability.
  • GeneSic Semiconductor recommends consulting their application notes and design guides for specific biasing and configuration recommendations. Additionally, their technical support team can provide guidance on device configuration and biasing for custom applications.
  • GeneSic Semiconductor provides a list of recommended gate drive circuits and components in their application notes and design guides. It's essential to use these recommended components to ensure proper device operation and to prevent damage to the device.
  • GeneSic Semiconductor recommends implementing proper overvoltage protection (OVP), overcurrent protection (OCP), and electrostatic discharge (ESD) protection circuits in the design. Their application notes and design guides provide guidance on implementing these protection circuits.
  • GeneSic Semiconductor provides reliability data and lifetime expectations in their datasheet and application notes. Additionally, their technical support team can provide more detailed information on device reliability and lifetime under specific operating conditions.

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GD2X50MPS12N Overview

Use the download button to access the GD2X50MPS12N 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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