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GDZ16B-HE3-08 - Vishay

Description: Silicon planar Zener diodes Low Zener impedance and low leakage current Popular in Asian designs Compact surface mount device Ideal for automated mounting AEC-Q101 qualified available ESD capability according to AEC-Q101: human body model > 8 kV machine model > 800 V

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GDZ16B-HE3-08 - Vishay PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323..
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GDZ16B-HE3-08 - Vishay  - 3D model - Small Outline Diode - SOD-323..
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GDZ16B-HE3-08 Details

  • Manufacturer Part Number:

    GDZ16B-HE3-08

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    50 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    16 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    2.04%

  • Working Test Current:

    5 mA

GDZ16B-HE3-08 Frequently Asked Questions (FAQs)

  • Store the devices in a dry, cool place, away from direct sunlight, and avoid exposure to moisture, dust, and extreme temperatures.
  • Yes, the GDZ16B-HE3-08 is designed for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality materials and manufacturing process.
  • Use proper ESD protection measures, such as wrist straps, mats, and bags, to prevent damage from electrostatic discharge when handling the device.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 183°C 60s, to ensure reliable solder joints.
  • Yes, the GDZ16B-HE3-08 is rated for operation up to 150°C, making it suitable for high-temperature applications, but ensure proper derating and thermal management.

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