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GDZ6V2LP3-7 - Diodes Incorporated

Description: Zener Diode 6.2 V 250 mW ±5.4% Surface Mount X3-DFN0603-2 -55°C ~ 150°C 1 µA @ 3 V

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PCB Footprints
GDZ6V2LP3-7 - Diodes Incorporated PCB footprint - Other - Other - X3-DFN0603-2_2026-2.2
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GDZ6V2LP3-7 - Diodes Incorporated  - 3D model - Other - X3-DFN0603-2_2026-2.2
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GDZ6V2LP3-7 Details

  • Manufacturer Part Number:

    GDZ6V2LP3-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    X3-DFN0603-2, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    6.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.41%

  • Working Test Current:

    5 mA

GDZ6V2LP3-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the GDZ6V2LP3-7 should minimize lead inductance, use a solid ground plane, and keep the input and output traces separate to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating temperature range (up to 125°C) and derate the device's power dissipation accordingly. Additionally, use a heat sink or thermal pad to improve heat dissipation, and consider using a thermally conductive PCB material.
  • The GDZ6V2LP3-7 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the GDZ6V2LP3-7 can be used in switching regulator applications due to its low RDS(on) and fast switching times. However, ensure that the device is properly driven and that the switching frequency is within the recommended range to minimize power losses and EMI.
  • Choose input and output capacitors with low ESR and high ripple current ratings to minimize voltage ripple and ensure stable operation. The recommended capacitance values are 10uF to 22uF for the input capacitor and 10uF to 47uF for the output capacitor.

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GDZ6V2LP3-7 Overview

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