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GF1B - onsemi

Description: Low forward voltage drop. ; High surge current capability.; High current capability. ; Easy pick and place.

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GF1B - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA-
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GF1B - onsemi  - 3D model - Diodes Moulded - SMA-
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GF1B Details

  • Manufacturer Part Number:

    GF1B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.8 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

GF1B Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure that the device is operated within the recommended temperature range and that the junction temperature is kept below 150°C.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead to filter the input and output lines. Ensure that the device is operated within the recommended frequency range.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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GF1B Overview

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Part Image GF1B-E3/5CA Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 1A, 100V V(RRM), Silicon, DO-214BA

Part Image GF1B-E3 Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 1A, 100V V(RRM), Silicon, DO-214BA

Part Image GF1BHE3/67A Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 1A, 100V V(RRM), Silicon, DO-214BA

Part Image GF1B International Semiconductor Inc

Rectifier Diode, 1 Phase, 1 Element, 1A, 100V V(RRM), Silicon, DO-214BA

Part Image GF1BHE3/67A Vishay Semiconductors

Diode Switching 100V 1A 2-Pin DO-214BA T/R

For a full list of alternate parts for GF1B, check out Findchips.com