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GF1D - onsemi

Description: Easy pick and place. ; High current capability. ; High surge current capability.; Low forward voltage drop.

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PCB Footprints
GF1D - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA
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GF1D - onsemi  - 3D model - Diodes Moulded - SMA
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GF1D Details

  • Manufacturer Part Number:

    GF1D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.8 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

GF1D Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage below 5V to ensure reliable operation.
  • Yes, GF1D can be used in switching power supply applications. However, ensure that the device is properly bypassed and decoupled to minimize electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues.
  • Check the power supply voltage, input voltage, and output current. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Also, review the application circuit and ensure it meets the recommended operating conditions.

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GF1D Overview

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