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GLF201208T470M - TDK

Description: 47µH Shielded Wirewound Inductor 120mA 5.3Ohm 0805 (2012 Metric)

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PCB Footprints
GLF201208T470M - TDK PCB footprint - Inductors Chip - Inductors Chip - GLF201208t
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GLF201208T470M - TDK  - 3D model - Inductors Chip - GLF201208t
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GLF201208T470M Details

  • Manufacturer Part Number:

    GLF201208T470M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    0805

  • Construction:

    Magnetic Shielded

  • DC Resistance:

    5.3 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.8 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    0.1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DCR IS MEASURED AT 20% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    20%

GLF201208T470M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the GLF201208T470M can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The GLF201208T470M is a moisture-sensitive device, and it should be handled and stored in accordance with the IPC/JEDEC J-STD-033 standard. This includes storing the components in a dry environment, using moisture-barrier bags, and baking the components before reflow soldering if they have been exposed to moisture.
  • The maximum reflow temperature for the GLF201208T470M is typically specified as 260°C, but it's recommended to consult the TDK Corporation's reflow soldering guidelines for the specific component to ensure optimal performance and reliability.
  • The GLF201208T470M is designed to meet the requirements of various industries, including automotive and industrial, which often involve high-vibration environments. However, it's recommended to consult the TDK Corporation's vibration testing data and guidelines to ensure the component meets the specific requirements of your application.
  • The ESR of the GLF201208T470M can be determined by measuring the impedance of the component at high frequencies using an impedance analyzer or a network analyzer. The ESR can also be calculated using the component's capacitance and loss tangent values, which are typically provided in the datasheet.

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GLF201208T470M Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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