GLFR1608T470M-LR - TDK

GLFR1608T470M-LR Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the GLFR1608T470M-LR?
  The recommended land pattern for the GLFR1608T470M-LR is a rectangular pad with a size of 1.6mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 1.2mm x 0.6mm.
• How do I handle the GLFR1608T470M-LR during reflow soldering?
  During reflow soldering, the GLFR1608T470M-LR should be placed on a flat, even surface to prevent warping or deformation. The component should be centered on the PCB and secured with a small amount of adhesive or tape to prevent movement during the reflow process.
• What is the maximum operating temperature for the GLFR1608T470M-LR?
  The maximum operating temperature for the GLFR1608T470M-LR is 125°C, with a derating of 1.25% per °C above 85°C. It is recommended to operate the component within the specified temperature range to ensure reliable performance and longevity.
• Can I use the GLFR1608T470M-LR in a high-vibration environment?
  Yes, the GLFR1608T470M-LR is designed to withstand high-vibration environments. However, it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent movement or detachment during operation.
• How do I store the GLFR1608T470M-LR to prevent moisture absorption?
  To prevent moisture absorption, the GLFR1608T470M-LR should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be stored in its original packaging or in a sealed bag with a desiccant packet to maintain a low humidity environment.