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GMR100HTBFMR033 - ROHM Semiconductor

Description: ROHM - GMR100HTBFMR033 - SMD Current Sense Resistor, 0.033 ohm, GMR Series, 2512 [6432 Metric], 3 W, ± 1%, Metal Strip

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PCB Footprints
GMR100HTBFMR033 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - 2512
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GMR100HTBFMR033 - ROHM Semiconductor  - 3D model - Resistor Chip - 2512
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GMR100HTBFMR033 Details

  • Manufacturer Part Number:

    GMR100HTBFMR033

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Height:

    0.4 mm

  • Package Length:

    6.4 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    7 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.033 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL PLATE

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Shape:

    ONE SURFACE

  • Tolerance:

    1%

GMR100HTBFMR033 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the GMR100HTBFMR033 would be to use a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's recommended to use a common mode choke or a ferrite bead to filter out high-frequency noise.
  • To ensure the reliability of the GMR100HTBFMR033 in high-temperature applications, it's recommended to follow the derating guidelines provided in the datasheet, and to ensure that the device is operated within its specified temperature range. Additionally, it's recommended to use a heat sink or a thermal interface material to dissipate heat effectively.
  • The recommended soldering profile for the GMR100HTBFMR033 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's also recommended to use a soldering iron with a temperature control, and to avoid applying excessive force or pressure during the soldering process.
  • To troubleshoot issues with the GMR100HTBFMR033, it's recommended to first check the PCB layout and ensure that it meets the recommended layout guidelines. Next, check the input voltage and current levels to ensure they are within the specified range. If the issue persists, it may be necessary to use a oscilloscope or a logic analyzer to debug the issue.
  • Yes, it's recommended to take standard ESD protection measures when handling the GMR100HTBFMR033, such as wearing an anti-static wrist strap, using an anti-static mat, and storing the devices in anti-static packaging. Additionally, it's recommended to avoid touching the device pins or leads, and to use a vacuum pickup tool or tweezers to handle the device.

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GMR100HTBFMR033 Overview

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