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GS1GHE3-LTP - MCC

Description: Dioden 400 V 1A Oberflächenmontage DO-214AC (SMA)

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Symbol
GS1GHE3-LTP - MCC - PCB symbol
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PCB Footprints
GS1GHE3-LTP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC)
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3D Models
GS1GHE3-LTP - MCC - 3D model - Diodes Moulded - SMA (DO-214AC)
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GS1GHE3-LTP Details

  • Manufacturer Part Number:

    GS1GHE3-LTP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

GS1GHE3-LTP Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the Micro Commercial Components' application note AN-103, which provides detailed guidelines for optimal PCB design and assembly.
  • The GS1GHE3-LTP has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat efficiently. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The GS1GHE3-LTP is rated for operation from -40°C to 125°C, but it's essential to note that the device's performance and reliability may degrade at extreme temperatures. Consult the datasheet and application notes for specific guidance on temperature-related considerations.
  • While the GS1GHE3-LTP is a high-quality device, it may not meet the specific requirements of high-reliability or aerospace applications. Engineers should consult with Micro Commercial Components' sales team or application engineers to discuss custom screening, testing, and qualification options for these types of applications.
  • Follow the recommended soldering profile and assembly guidelines provided in the datasheet and application notes. Ensure the PCB is designed with adequate clearance and spacing to prevent solder bridging and other assembly issues.

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GS1GHE3-LTP Overview

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