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GS4288C36GL-18 - GSI TECHNOLOGY

Description: Pin- and function-compatible with Micron RLDRAM® II 533 MHz DDR operation (1.067Gb/s/pin data rate) 38.4 Gb/s peak bandwidth (x36 at 533 MHz clock frequency) 8M x 36 organization available 8 internal banks for concurrent operation and maximum bandwidth Reduced cycle time (15 ns at 533 MHz) Address Multiplexing (Nonmultiplexed address option available) SRAM-type interface Programmable Read Latency (RL), row cycle time, and burst sequence length Balanced Read and Write Latencies in order to optimi

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GS4288C36GL-18 - GSI TECHNOLOGY PCB footprint - BGA - BGA - 144-Bump BGA (Package L)..
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GS4288C36GL-18 - GSI TECHNOLOGY  - 3D model - BGA - 144-Bump BGA (Package L)..
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GS4288C36GL-18 Details

  • Manufacturer Part Number:

    GS4288C36GL-18

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, UBGA-144

  • Pin Count:

    144

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.B.2.B

  • HTS Code:

    8542.32.00

  • Manufacturer:

    GSI Technology

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO REFRESH

  • JESD-30 Code:

    R-PBGA-B144

  • JESD-609 Code:

    e1

  • Memory Density:

    301989888 bit

  • Memory IC Type:

    DDR DRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    144

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Organization:

    8MX36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    11 mm

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GS4288C36GL-18 Overview

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