ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH
Clock Frequency-Max (fCLK):
150 MHz
I/O Type:
COMMON
JESD-30 Code:
R-PBGA-B165
JESD-609 Code:
e1
Length:
15 mm
Memory Density:
37748736 bit
Memory IC Type:
STANDARD SRAM
Memory Width:
36
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
165
Number of Words:
1048576 words
Number of Words Code:
1000000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
1MX36
Output Characteristics:
3-STATE
Package Body Material:
PLASTIC/EPOXY
Package Code:
LBGA
Package Equivalence Code:
BGA165,11X15,40
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, LOW PROFILE
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.4 mm
Standby Current-Max:
0.04 A
Standby Voltage-Min:
2.3 V
Supply Current-Max:
0.195 mA
Supply Voltage-Max (Vsup):
2.7 V
Supply Voltage-Min (Vsup):
2.3 V
Supply Voltage-Nom (Vsup):
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Width:
13 mm
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GS832236AGD-150I Overview
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