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GS88136CGD-200 - GSI TECHNOLOGY

Description: SRAM 2.5 or 3.3V 256K x 36 9M

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GS88136CGD-200 - GSI TECHNOLOGY PCB footprint - BGA - BGA - 165-BGA
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GS88136CGD-200 - GSI TECHNOLOGY  - 3D model - BGA - 165-BGA
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GS88136CGD-200 Details

  • Manufacturer Part Number:

    GS88136CGD-200

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

  • Pin Count:

    165

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.B.2.B

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    GSI Technology

  • YTEOL:

    5.15

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE

  • JESD-30 Code:

    R-PBGA-B165

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    CACHE SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

GS88136CGD-200 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the GS88136CGD-200 is -40°C to +85°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
  • To ensure data integrity and prevent data corruption during power-up and power-down cycles, it's recommended to follow the power-up and power-down sequencing guidelines provided in the datasheet. Additionally, consider implementing a power-on reset (POR) circuit to ensure a clean reset of the device during power-up.
  • The recommended clock frequency for the GS88136CGD-200 is up to 200 MHz, and the clock-to-output delay (tCKO) is typically around 2-3 ns. However, the actual clock frequency and clock-to-output delay may vary depending on the specific application and system requirements.
  • To handle asynchronous inputs and ensure proper synchronization with the clock domain, it's recommended to use a synchronizer circuit, such as a double-flop synchronizer or a FIFO-based synchronizer, to resynchronize the asynchronous inputs with the clock domain.
  • The maximum current consumption of the GS88136CGD-200 is typically around 1.5 A at 1.8V and 200 MHz. To reduce power consumption, consider using power-saving features such as clock gating, dynamic voltage and frequency scaling (DVFS), and reducing the clock frequency during idle periods.

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GS88136CGD-200 Overview

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Part Image GS88136CD-200IT GSI Technology

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Part Image GS88136CGD-200IT GSI Technology

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Part Image GS88136CGD-200I GSI Technology

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