A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat effectively. A minimum of 2 oz copper thickness is recommended.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the pads, and use a reflow oven with a peak temperature of 240°C to 250°C. Avoid overheating or using excessive solder paste.
The maximum allowed voltage transient for the GTCS26-900M-R05-2 is 1.5 times the rated voltage (900V) for a duration of up to 100 ms. Exceeding this may cause device damage or failure.
While the GTCS26-900M-R05-2 is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments (>80% RH) without proper protection. Consider using a conformal coating or potting the device to prevent moisture ingress.
Store the GTCS26-900M-R05-2 in a dry, cool place (<30°C, <60% RH) away from direct sunlight. Avoid exposing the device to moisture, chemicals, or physical stress during storage.
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GTCS26-900M-R05-2 Overview
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