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H11G3 - onsemi

Description: 6-Pin Optoisolator with Darlington Output and on-chip resistors. High voltage isolation, CTR = 200% Min, low leakage.

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H11G3 - onsemi - PCB symbol
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PCB Footprints
H11G3 - onsemi PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 6-Pin DIP Thru Hole Case 730A-04
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H11G3 - onsemi - 3D model - Dual-In-Line Packages - 6-Pin DIP Thru Hole Case 730A-04
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H11G3 Details

  • Manufacturer Part Number:

    H11G3

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, DIP-6

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    55 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Current Transfer Ratio-Min:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    7500 V

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.15 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    DARLINGTON OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.25 W

  • Response Time-Max:

    0.000005 s

  • Surface Mount:

    NO

H11G3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the H11G3 involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to follow the recommended biasing circuit in the datasheet, which includes a voltage divider network to set the bias voltage. Also, ensure that the bias voltage is stable and within the recommended range of 2.5V to 5.5V.
  • The maximum allowable power dissipation for the H11G3 is 250mW. Exceeding this limit can cause the device to overheat, leading to reduced performance and potentially even damage.
  • To protect the H11G3 from ESD damage, use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins. Also, follow proper handling and storage procedures to prevent ESD damage.
  • The recommended operating temperature range for the H11G3 is -40°C to 125°C. Operating the device outside of this range can affect its performance and reliability.

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