H27UAG8T2BTR-BC - Hynix

H27UAG8T2BTR-BC Details

• Manufacturer Part Number:

  H27UAG8T2BTR-BC

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active Unconfirmed

• Part Package Code:

  TSOP1

• Package Description:

  12 X 20 MM, PLASTIC, TSOP1-48

• Pin Count:

  48

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  SK Hynix Inc

• YTEOL:

  2

• JESD-30 Code:

  R-PDSO-G48

• Length:

  18.4 mm

• Memory Density:

  17179869184 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  48

• Number of Words:

  2147483648 words

• Number of Words Code:

  2000000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  2GX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSOP1

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  3.3 V

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Type:

  MLC NAND TYPE

• Width:

  12 mm