H5AN8G6NDJR-XNC - Hynix

H5AN8G6NDJR-XNC Details

• Manufacturer Part Number:

  H5AN8G6NDJR-XNC

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-96

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  SK Hynix Inc

• YTEOL:

  5

• Access Mode:

  MULTI BANK PAGE BURST

• Access Time-Max:

  3200 ns

• Additional Feature:

  AUTO/SELF REFRESH

• Clock Frequency-Max (fCLK):

  1600 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  4,8

• JESD-30 Code:

  R-PBGA-B96

• Length:

  13 mm

• Memory Density:

  8589934592 bit

• Memory IC Type:

  DDR4 DRAM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  96

• Number of Words:

  536870912 words

• Number of Words Code:

  512000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Organization:

  512MX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Equivalence Code:

  BGA96,9X16,32

• Package Shape:

  RECTANGULAR

• Self Refresh:

  YES

• Sequential Burst Length:

  4,8

• Standby Current-Max:

  0.033 A

• Supply Current-Max:

  0.063 mA

• Supply Voltage-Max (Vsup):

  1.26 V

• Supply Voltage-Min (Vsup):

  1.14 V

• Supply Voltage-Nom (Vsup):

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  7.5 mm