HA1-5104-2 footprint, schematic symbol and 3D model by Renesas Electronics

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PCB Footprints

HA1-5104-2 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - D14.3

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Part Number HA1-5104-2
Manufacturer Renesas Electronics
Pin Count 14
Part Category Integrated Circuit
Package Category Ceramic Dual-In-Line Packages
Footprint Name Ceramic Dual-In-Line Packages - D14.3
Released Date Jan 3, 2020
Last Modified Date Jan 29, 2025 12:30 PM UTC
Pinout / Pin List Click Here (Member Only)

HA1-5104-2 Details

Manufacturer Part Number:
HA1-5104-2
Brand Name:
Renesas
Pbfree Code:
No
Rohs Code:
No
Part Life Cycle Code:
Active
Part Package Code:
CERDIP
Package Description:
DIP-14
Pin Count:
14
Manufacturer Package Code:
F14.3
Reach Compliance Code:
Not Compliant
Country Of Origin:
Philippines, Thailand
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Factory Lead Time:
18 Weeks
Manufacturer:
Renesas Electronics Corporation
YTEOL:
4.2
Amplifier Type:
OPERATIONAL AMPLIFIER
Architecture:
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB):
0.325 µA
Bias Current-Max (IIB) @25C:
0.2 µA
Common-mode Reject Ratio-Min:
86 dB
Common-mode Reject Ratio-Nom:
95 dB
Frequency Compensation:
YES
Input Offset Voltage-Max:
3000 µV
JESD-30 Code:
R-GDIP-T14
JESD-609 Code:
e0
Length:
19.94 mm
Low-Bias:
NO
Low-Offset:
NO
Micropower:
NO
Neg Supply Voltage Limit-Max:
-20 V
Neg Supply Voltage-Nom (Vsup):
-15 V
Number of Functions:
4
Number of Terminals:
14
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
CERAMIC, GLASS-SEALED
Package Code:
DIP
Package Equivalence Code:
DIP14,.3
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Packing Method:
TUBE
Power:
NO
Programmable Power:
NO
Seated Height-Max:
5.08 mm
Slew Rate-Min:
1 V/us
Slew Rate-Nom:
3 V/us
Supply Current-Max:
6.5 mA
Supply Voltage Limit-Max:
20 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
NO
Technology:
BIPOLAR
Temperature Grade:
MILITARY
Terminal Finish:
TIN LEAD
Terminal Form:
THROUGH-HOLE
Terminal Pitch:
2.54 mm
Terminal Position:
DUAL
Unity Gain BW-Nom:
8000
Voltage Gain-Min:
100000
Wideband:
NO
Width:
7.62 mm

HA1-5104-2 Frequently Asked Questions (FAQs)

A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
Operating the device at a lower voltage may reduce power consumption but may also affect performance and reliability. Operating at a higher voltage may improve performance but increases the risk of overheating and reduces lifespan.
Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly configured and that the output capacitor values are within the recommended range. Use an oscilloscope to monitor the output voltage and check for any signs of oscillation or instability.
The device is designed to meet CISPR 22 Class B emissions standards. Ensure that the PCB is designed with EMI mitigation in mind, including the use of shielding, filtering, and proper grounding. Follow good EMC design practices to minimize radiated emissions.

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