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HA9P5104-9 - Renesas Electronics

Description: Operational Amplifiers - Op Amps

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HA9P5104-9 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16 LEAD WIDE BODY SMALL OUTLINE
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HA9P5104-9 Details

  • Manufacturer Part Number:

    HA9P5104-9

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Bias Current-Max (IIB) @25C:

    0.2 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    2.65 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    3 V/us

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    80000

  • Wideband:

    NO

  • Width:

    7.5 mm

HA9P5104-9 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal simulation tools to optimize the design.
  • Critical timing parameters include clock frequency, setup and hold times, and output delay. Ensure that these parameters are met by carefully designing the clock tree, using clock domain crossing (CDC) techniques, and optimizing the PCB layout.
  • Use a power sequencing scheme that ensures the core voltage is stable before the clock is enabled. Implement a POR circuit that holds the device in reset until the power supplies are stable and the clock is valid.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines. Implement latch-up prevention measures such as using a latch-up immune process, adding guard rings, and minimizing substrate coupling.

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