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HBW101M1ETR-0608 - Lelon

Description: Aluminum Organic Polymer Capacitors 100uF 20% 25V Low ESR High Ripple

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HBW101M1ETR-0608 - Lelon - PCB symbol
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PCB Footprints
HBW101M1ETR-0608 - Lelon PCB footprint - Capacitor Al Electrolytic - Capacitor Al Electrolytic - 6.3*7.7
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3D Models
HBW101M1ETR-0608 - Lelon - 3D model - Capacitor Al Electrolytic - 6.3*7.7
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HBW101M1ETR-0608 Details

  • Manufacturer Part Number:

    HBW101M1ETR-0608

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Lelon Electronics Corp

  • YTEOL:

    7

  • Additional Feature:

    ESR IS MEASURED AT 100 KHZ

  • Capacitance:

    100 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    30 mΩ

  • Height:

    7.7 mm

  • Leakage Current:

    0.025 mA

  • Length:

    6.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    140 mA

  • Size Code:

    2626

  • Surface Mount:

    YES

  • Tan Delta:

    0.14

  • Terminal Shape:

    FLAT

  • Width:

    6.6 mm

HBW101M1ETR-0608 Frequently Asked Questions (FAQs)

  • The recommended land pattern for HBW101M1ETR-0608 can be found in the manufacturer's application note or on their website. Typically, it follows the IPC-7351 standard for surface mount components.
  • Proper thermal management is crucial for the reliability of HBW101M1ETR-0608. Ensure good airflow around the component, and consider using thermal vias or a heat sink if the operating temperature exceeds 85°C.
  • The MSL of HBW101M1ETR-0608 is typically MSL 3, which means it can withstand up to 168 hours of exposure to 30°C/60% RH before soldering. However, it's recommended to check the manufacturer's documentation for the most up-to-date information.
  • HBW101M1ETR-0608 is designed for general-purpose applications, but it may not be suitable for high-vibration environments. If your application involves vibration, consider using a component with a higher vibration rating or consult with the manufacturer for guidance.
  • The recommended soldering profile for HBW101M1ETR-0608 typically follows the IPC-J-STD-020 standard. A peak temperature of 240°C to 250°C and a dwell time of 30 seconds to 60 seconds is recommended. However, it's best to consult the manufacturer's documentation for specific guidance.

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HBW101M1ETR-0608 Overview

Use the download button to access the HBW101M1ETR-0608 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like HBW10, or try a keyword search, such as Ceramic Capacitors

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HBW101M1ETR-0608 Alternates

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For a full list of alternate parts for HBW101M1ETR-0608, check out Findchips.com