HC2LP-1R0-R footprint, schematic symbol and 3D model by Eaton

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HC2LP-1R0-R Details

The recommended PCB land pattern for HC2LP-1R0-R is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm clearance around the pad to ensure proper soldering and to prevent electrical shorts.
While HC2LP-1R0-R is rated for operation up to 125°C, it's not recommended for high-temperature applications above 105°C without proper derating. Consult Coiltronics' application notes for guidance on high-temperature use.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB land pattern. Avoid applying excessive heat or pressure, which can damage the component.
Yes, HC2LP-1R0-R is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature to ensure reliable joints.
Store HC2LP-1R0-R in a dry, cool place, away from direct sunlight and moisture. Handle the components by the body, avoiding touching the leads or electrical contacts to prevent damage or contamination.

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