The recommended land pattern for the HC9-6R8-R is a rectangular pad with dimensions of 3.8mm x 2.5mm, with a 1.1mm diameter hole in the center for the pin.
The HC9-6R8-R is rated for operation up to 125°C, but derating is required above 85°C. Consult the datasheet for specific derating guidelines.
The HC9-6R8-R is a lead-free component and can be soldered using a standard reflow soldering process. Ensure that the component is properly aligned and the soldering temperature does not exceed 260°C.
The self-resonant frequency of the HC9-6R8-R is approximately 150 MHz, but this can vary depending on the specific application and PCB layout.
The HC9-6R8-R is rated for a maximum current of 1.3A, but this can be affected by the operating temperature and other factors. Consult the datasheet for specific current handling guidelines.
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HC9-6R8-R Overview
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