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HCS3920FT1L00 - Stackpole Electronics, Inc.

Description: RES SHUNT, 3920, 0.001 ohm, 1%, 5W

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HCS3920FT1L00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
HCS3920FT1L00 - Stackpole Electronics, Inc. PCB footprint - Other - Other - HCS3920
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HCS3920FT1L00 - Stackpole Electronics, Inc. - 3D model - Other - HCS3920
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HCS3920FT1L00 Details

  • Manufacturer Part Number:

    HCS3920FT1L00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    7.3

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.92 mm

  • Package Length:

    10.2 mm

  • Package Style:

    SMT

  • Package Width:

    5.2 mm

  • Packing Method:

    TR, EMBOSSED PLASTIC, 13 INCH

  • Rated Power Dissipation (P):

    7 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.001 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    3920

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    GULL WING

  • Tolerance:

    1%

HCS3920FT1L00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the HCS3920FT1L00 can be found in the SEI Stackpole Electronics Inc. application note or on their website. It typically includes a rectangular pad with a size of 1.5mm x 0.75mm and a thermal pad with a size of 2.5mm x 2.5mm.
  • The thermal pad of the HCS3920FT1L00 should be connected to a solid ground plane on the PCB to ensure good thermal performance. A thermal via array can be used to connect the thermal pad to the ground plane.
  • The maximum operating temperature of the HCS3920FT1L00 is 150°C, as specified in the datasheet. However, it's recommended to operate the device at a temperature below 125°C for optimal performance and reliability.
  • The HCS3920FT1L00 is a surface-mount device and can be sensitive to high-vibration environments. It's recommended to use a vibration-dampening material or a mechanical fastening system to secure the device to the PCB in high-vibration applications.
  • To ensure the reliability of the HCS3920FT1L00 in a humid environment, it's recommended to apply a conformal coating to the PCB and ensure that the device is properly sealed. Additionally, the PCB should be designed with moisture-resistant materials and a humidity-resistant finish.

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HCS3920FT1L00 Overview

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