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HCSM2818FT15L0 - Stackpole Electronics, Inc.

Description: RES SHUNT, 2818, 0.015 ohm, 1%, 5W

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HCSM2818FT15L0 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
HCSM2818FT15L0 - Stackpole Electronics, Inc. PCB footprint - Other - Other - HCSM2818FT15L0-1
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3D Models
HCSM2818FT15L0 - Stackpole Electronics, Inc. - 3D model - Other - HCSM2818FT15L0-1
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HCSM2818FT15L0 Details

  • Manufacturer Part Number:

    HCSM2818FT15L0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    7

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.65 mm

  • Package Length:

    7.15 mm

  • Package Style:

    SMT

  • Package Width:

    4.95 mm

  • Packing Method:

    TR, PLASTIC, 13 INCH

  • Rated Power Dissipation (P):

    7 W

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.015 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2818

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    75 ppm/°C

  • Terminal Shape:

    ONE SURFACE

  • Tolerance:

    1%

HCSM2818FT15L0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for HCSM2818FT15L0 can be found in the Stackpole Electronics Inc. application note AN-120, which provides guidelines for PCB layout and land pattern design.
  • To ensure proper thermal management, it is recommended to use a thermal pad or heat sink on the bottom of the device, and to design the PCB with thermal vias to dissipate heat efficiently. Additionally, the device should be mounted on a multi-layer PCB with a thermal layer to further improve heat dissipation.
  • The maximum operating temperature range for HCSM2818FT15L0 is -55°C to 150°C, as specified in the datasheet. However, it is recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • Yes, HCSM2818FT15L0 is suitable for high-frequency applications up to 1 GHz. However, it is recommended to evaluate the device's performance in the specific application and consider factors such as parasitic inductance, capacitance, and impedance matching.
  • The recommended soldering process for HCSM2818FT15L0 is a reflow soldering process with a peak temperature of 260°C and a dwell time of 20-30 seconds. It is also recommended to use a solder paste with a melting point of 217°C to 220°C.

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HCSM2818FT15L0 Overview

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