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HD3SS212ZQER - Texas Instruments

Description: 5.4-Gbps DisplayPort 1.2 2-to-1 differential switch

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PCB Footprints
HD3SS212ZQER - Texas Instruments PCB footprint - BGA - BGA - ZQE(s-pbga-n48)
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3D Models
HD3SS212ZQER - Texas Instruments  - 3D model - BGA - ZQE(s-pbga-n48)
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HD3SS212ZQER Details

  • Manufacturer Part Number:

    HD3SS212ZQER

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    S-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    22 dB

  • On-state Resistance Match-Nom:

    1.5 Ω

  • On-state Resistance-Max (Ron):

    12 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.74 mm

  • Supply Current-Max (Isup):

    5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    350 ns

  • Switch-on Time-Max:

    350 ns

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

HD3SS212ZQER Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS212ZQER involves keeping the high-speed signals away from the power and ground planes, using a solid ground plane, and minimizing the length of the traces. Additionally, using a shielded cable for the USB signals and placing the device close to the connector can help reduce EMI.
  • The HD3SS212ZQER requires a 1.8V to 3.3V power supply, and it's recommended to power the device using a low-dropout regulator (LDO) to minimize noise. The power sequencing requirements involve powering up the VCC pin first, followed by the VBUS pin, and then the USB signals.
  • The HD3SS212ZQER has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal via or a thermal pad on the PCB can help to improve heat dissipation. Additionally, ensuring good airflow around the device and using a heat sink if necessary can help to keep the device within its operating temperature range.
  • To implement the HD3SS212ZQER in a USB-C application, you'll need to connect the device to the USB-C receptacle, configure the device for USB-C mode, and use an external resistor to set the device's operating mode. You'll also need to ensure that the device is properly powered and that the USB signals are properly routed.
  • The HD3SS212ZQER has built-in ESD protection, but it's still important to follow proper ESD handling procedures when handling the device. Additionally, using ESD protection devices such as TVS diodes or ESD arrays on the USB signals can help to protect the device from ESD events.

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HD3SS212ZQER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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