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HD3SS3202IRSVR - Texas Instruments

Description: Two-channel differential 2:1/1:2 USB3.1 mux & demux

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HD3SS3202IRSVR - Texas Instruments - PCB symbol
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HD3SS3202IRSVR - Texas Instruments PCB footprint - Other - Other - HD3SS3202IRSVR-4
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HD3SS3202IRSVR - Texas Instruments - 3D model - Other - HD3SS3202IRSVR-4
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HD3SS3202IRSVR Details

  • Manufacturer Part Number:

    HD3SS3202IRSVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-06-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    10000 MHz

  • JESD-30 Code:

    R-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    20 dB

  • On-state Resistance Match-Nom:

    0.7 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

HD3SS3202IRSVR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a common mode filter or a ferrite bead to reduce EMI.
  • The HD3SS3202IRSVR requires a 1.8V to 3.3V power supply. Ensure that the power supply is stable and clean. Power sequencing is not critical, but it's recommended to power up the VCC pin first, followed by the VCCIO pin.
  • The HD3SS3202IRSVR has a thermal pad that must be connected to a solid ground plane to dissipate heat. Use thermal vias to connect the thermal pad to the ground plane. Ensure good airflow around the device and consider using a heat sink if the device is expected to operate at high temperatures.
  • Use an oscilloscope to check the signal integrity and power consumption. Check the power supply voltage and current consumption. Use a logic analyzer to check the digital signals. Check the PCB layout and ensure that it meets the recommended layout guidelines.
  • Yes, the crystal oscillator circuit requires a 26 MHz crystal with a load capacitance of 18 pF to 22 pF. Ensure that the crystal oscillator circuit is properly decoupled from the power supply and that the PCB layout is optimized for signal integrity.

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HD3SS3202IRSVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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