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HDSP-513E - Avago Technologies

Description: Displays Segmented Module 1DIGIT 8LED Hi-Eff. Red CC 10-Pin DIP Tube

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PCB Footprints
HDSP-513E - Avago Technologies PCB footprint - Dual-In-Line Sockets - Dual-In-Line Sockets - HDSP-513E
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3D Models
HDSP-513E - Avago Technologies  - 3D model - Dual-In-Line Sockets - HDSP-513E
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HDSP-513E Details

  • Manufacturer Part Number:

    HDSP-513E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-10

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    6

  • Color:

    HIGH EFFICIENCY RED

  • Configuration:

    COMMON CATHODE, 1 DIGIT WITH DECIMAL POINT

  • Display Height:

    14.22 mm

  • Forward Current-Max:

    0.025 A

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -35 °C

  • Optoelectronic Device Type:

    7 SEG NUMERIC LED DISPLAY

  • Terminal Finish:

    Tin (Sn)

HDSP-513E Frequently Asked Questions (FAQs)

  • Broadcom provides a reference design guide that includes PCB layout recommendations and thermal management guidelines to ensure optimal performance and reliability of the HDSP-513E. It's essential to follow these guidelines to avoid thermal issues and ensure signal integrity.
  • The HDSP-513E has various power-saving features, such as dynamic voltage and frequency scaling. To optimize power consumption, engineers can adjust the clock frequency, voltage, and power modes according to their application's requirements. Broadcom provides power estimation tools and guidelines to help with this process.
  • To ensure signal integrity, it's crucial to follow best practices for routing and signal integrity, such as using differential pairs, minimizing trace lengths, and avoiding vias and stubs. Broadcom provides guidelines and recommendations for signal integrity and routing in their application notes and design guides.
  • Broadcom provides a range of debugging tools, including software development kits (SDKs), debug interfaces, and diagnostic tools. Engineers can use these tools to troubleshoot and debug issues, such as signal integrity problems, power issues, or firmware bugs.
  • The HDSP-513E has undergone rigorous reliability and qualification tests, including temperature and humidity testing, vibration and shock testing, and electrical stress testing. Broadcom provides detailed information on the testing and qualification process in their reliability reports and datasheets.

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