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HDSP-703G - Avago Technologies

Description: Displays Dot Matrix Module 35LED Green CC 12-Pin DIP Tube

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PCB Footprints
HDSP-703G - Avago Technologies PCB footprint - Other - Other - HDSP-703G-1
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3D Models
HDSP-703G - Avago Technologies  - 3D model - Other - HDSP-703G-1
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HDSP-703G Details

  • Manufacturer Part Number:

    HDSP-703G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-12

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    6.1

  • Color:

    GREEN

  • Color@Wavelength:

    Green

  • Configuration:

    COMMON CATHODE, 1 DIGIT

  • Display Height:

    17.3 mm

  • Forward Current-Max:

    0.015 A

  • Forward Voltage-Max:

    3.5 V

  • JESD-609 Code:

    e3

  • Number of Characters:

    1

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    5 X 7 DOT MATRIX LED DISPLAY

  • Peak Wavelength:

    566 nm

  • Terminal Finish:

    Tin (Sn)

HDSP-703G Frequently Asked Questions (FAQs)

  • Broadcom provides a reference design guide that includes PCB layout recommendations and thermal management guidelines to ensure optimal performance and reliability of the HDSP-703G. Engineers can request this guide from Broadcom or consult with their FAE.
  • The HDSP-703G has various power-saving features, such as dynamic voltage and frequency scaling. Engineers can consult the datasheet and application notes for guidance on optimizing power consumption. Additionally, Broadcom provides a power calculator tool to help estimate power consumption based on specific use cases.
  • The HDSP-703G has a complex clocking and timing configuration. Broadcom provides a clocking and timing configuration guide that includes recommended settings for various applications. Engineers can also consult with Broadcom's technical support team for customized guidance.
  • Broadcom provides guidelines for signal integrity and EMI mitigation in the HDSP-703G's datasheet and application notes. Engineers should follow best practices for PCB design, such as using differential pairs, minimizing trace lengths, and using shielding and filtering techniques to reduce EMI.
  • The HDSP-703G has a range of firmware and software development tools, including the Broadcom SDK and development boards. Engineers can access these tools and resources through Broadcom's website or by contacting their FAE. Broadcom also provides documentation, tutorials, and support to help engineers get started with the tools.

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HDSP-703G Overview

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Part Image HDSP-703G Broadcom Limited

1-Character, Green, 17.3mm

Part Image HDSP-703G Agilent Technologies Inc

1-Character, Green, 17.14mm