Adam Technologies recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended for the top and bottom layers. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Adam Technologies recommends reducing the output current by 1.5% per degree Celsius above 25°C. Additionally, ensure proper thermal management and heat dissipation to prevent overheating.
The HDT26-PD is designed to meet CISPR 22 Class B emissions standards. To minimize EMI and RFI, Adam Technologies recommends using a shielded enclosure, keeping the device away from sensitive circuits, and using a common-mode choke on the input lines. Additionally, ensure proper PCB layout and grounding to reduce radiation.
Yes, the HDT26-PD can be used in a redundant or parallel configuration to increase power availability and reliability. However, it's essential to follow Adam Technologies' guidelines for paralleling and redundancy to ensure proper operation and to prevent damage to the devices.
The HDT26-PD is a sensitive electronic component and requires proper storage and handling to prevent damage. Adam Technologies recommends storing the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical components. Use anti-static wrist straps and mats when handling the device.
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HDT26-PD Overview
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