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HE721C1200 - LITTELFUSE

Description: SPDT Reed Relay, 12V dc

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Symbol
HE721C1200 - LITTELFUSE - PCB symbol
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PCB Footprints
HE721C1200 - LITTELFUSE PCB footprint - Other - Other - HE721C1200_2024
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3D Models
HE721C1200 - LITTELFUSE - 3D model - Other - HE721C1200_2024
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HE721C1200 Details

  • Manufacturer Part Number:

    HE721C1200

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Body Breadth:

    7.22 mm

  • Body Height:

    5.5 mm

  • Body Length or Diameter:

    19.05 mm

  • Coil Current(DC)-Max:

    0.024 A

  • Coil Operate Voltage(DC):

    8 V

  • Coil Power:

    288 mW

  • Coil Release Voltage(DC):

    1 V

  • Coil Resistance:

    500 Ω

  • Coil Voltage(DC)-Max:

    22 V

  • Coil Voltage-Nom:

    12 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Rating R Load:

    0.18A@120VAC

  • Contact Current(AC)-Max:

    0.18 A

  • Contact Current(DC)-Max:

    0.25 A

  • Contact (DC) Max Power Rating R Load:

    5W@175VDC

  • Contact (DC) Max Rating R Load:

    0.25A@175VDC

  • Contact Resistance:

    200 mΩ

  • Contact Voltage(AC)-Max:

    120 V

  • Contact Voltage(DC)-Max:

    175 V

  • Contact/Output Supply Type:

    AC/DC

  • Input Switching Control Type:

    Random

  • Insulation Resistance:

    10000000000 Ω

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Terminals:

    8

  • Operate Time:

    3 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BULK

  • Reference Standard:

    CUL; UL

  • Relay Action:

    MOMENTARY

  • Relay Form:

    1 FORM C

  • Relay Function:

    SPDT

  • Relay Type:

    DRY REED RELAY

  • Release Time:

    3 ms

  • Sealing:

    HERMETICALLY SEALED

  • Surface Mount:

    NO

  • Terminal Length:

    0.002999745999491999 inch

  • Termination Type:

    SOLDER

HE721C1200 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper pad underneath the device, with multiple vias connecting to a solid ground plane on the bottom layer. This helps to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to melt the solder. Avoid overheating the device.
  • The HE721C1200 can withstand surge currents up to 200A for 8/20μs according to the IEC 61000-4-5 standard. However, it's recommended to consult the datasheet and application notes for specific surge protection requirements.
  • While the HE721C1200 is primarily designed for surge protection, it can be used in high-frequency applications up to 1 GHz. However, the device's impedance and insertion loss should be considered in the design. Consult the datasheet and application notes for more information.
  • Select the correct variant based on the required voltage rating, surge current rating, and package type. Consult the datasheet and application notes to determine the suitable variant for your specific application.

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HE721C1200 Overview

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