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HF81GS-Z - Monolithic Power Systems (MPS)

Description: Disconnect series discharge resistors from L-N when AC voltage is applied • Connect series discharge resistors with L-N to discharge the X capacitor when AC voltage is unplugged • Supplied by AC voltage directly and doesn’t need external bias • Meets safety standards for use before or after input fuse • No external ground pin leads to high common mode surge immunity • 1000V internal JFET inside leads to high differential surge immunity • >4mm creepage on packag

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HF81GS-Z - Monolithic Power Systems (MPS) - PCB symbol
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HF81GS-Z - Monolithic Power Systems (MPS) PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8
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3D Models
HF81GS-Z - Monolithic Power Systems (MPS) - 3D model - Small Outline Packages - SOIC8
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HF81GS-Z Details

  • Manufacturer Part Number:

    HF81GS-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

HF81GS-Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the power lines.
  • Ensure that the output capacitor has a low ESR, and the input capacitor has a high capacitance. Also, add a small ceramic capacitor (e.g., 10nF) between the VIN and GND pins to filter out high-frequency noise.
  • Although the datasheet specifies a maximum input voltage of 18V, it's recommended to limit the input voltage to 15V to ensure reliable operation and prevent damage to the IC.
  • The output voltage ripple can be estimated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. This type of capacitor provides a low ESR and is suitable for high-frequency switching applications.

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