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HFA1105IBZ - Renesas Electronics

Description: The HFA1105 is a High-Speed, low power current feedback amplifier built with Intersil's proprietary complementary bipolar UHF-1 process. This amplifier features an excellent combination of low power dissipation (58mW) and high performance. The slew rate, bandwidth, and low output impedance (0. 08Ω) make this amplifier a good choice for driving Flash ADCs. Component and composite video systems also benefit from this op amp's excellent gain flatness, and good differential gain and phase specifications. The HF

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HFA1105IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
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HFA1105IBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
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HFA1105IBZ Details

  • Manufacturer Part Number:

    HFA1105IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Common-mode Reject Ratio-Min:

    47 dB

  • Common-mode Reject Ratio-Nom:

    50 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1200 V/us

  • Supply Current-Max:

    6.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Wideband:

    YES

  • Width:

    3.9 mm

HFA1105IBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the application note AN9854, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The HFA1105IBZ has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, Renesas recommends using a heat sink or thermal interface material to further reduce thermal resistance.
  • The HFA1105IBZ has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed +150°C to ensure reliable operation and prevent damage.
  • The HFA1105IBZ has a shutdown pin (SHDN) that can be used to reduce power consumption when the device is not in use. Additionally, Renesas recommends using a low-dropout regulator (LDO) to supply the device with a stable voltage, and optimizing the PCB design to minimize power consumption.
  • Renesas recommends using a 10uF to 22uF ceramic capacitor as the input capacitance (CIN) to ensure stable operation and minimize noise. The capacitor should be placed as close as possible to the VIN pin.

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HFA1105IBZ Overview

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