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HFA1112IBZ - Renesas Electronics

Description: Intersil HFA1112IBZ, Programmable Gain Amplifier, 8-Pin SOIC

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PCB Footprints
HFA1112IBZ - Renesas Electronics PCB footprint - Other - Other - SOIC127P600X175-8N
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HFA1112IBZ - Renesas Electronics  - 3D model - Other - SOIC127P600X175-8N
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HFA1112IBZ Details

  • Manufacturer Part Number:

    HFA1112IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    65 µA

  • Bandwidth (3dB)-Nom:

    850 MHz

  • Bias Current-Max (IIB) @25C:

    40 µA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    0.05 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1500 V/us

  • Slew Rate-Nom:

    1900 V/us

  • Supply Current-Max:

    33 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

HFA1112IBZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter and a ferrite bead to reduce EMI.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, and place it as close to the device as possible. Ensure the power supply is stable and within the recommended voltage range (2.7V to 5.5V).
  • The HFA1112IBZ can achieve a maximum data transfer rate of 115.2 kbps in asynchronous mode and 1 Mbps in synchronous mode, depending on the clock frequency and communication protocol used.
  • Implement error detection and correction mechanisms, such as checksums and retries, to handle transmission errors. Use the device's built-in error detection and correction features, such as parity and framing error detection.
  • Yes, the HFA1112IBZ has built-in noise tolerance features, such as hysteresis and slew rate control, to improve noise immunity. However, it's still important to follow proper PCB design and layout practices to minimize noise coupling.

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