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HFA1135IBZ - Renesas Electronics

Description: The HFA1135 is a High-Speed, low power current feedback amplifier build with Intersil's proprietary complementary bipolar UHF-1 process. This amplifier features user programmable output limiting, via the VH and VL pins. The HFA1135 is the ideal choice for High-Speed, low power applications requiring output limiting (e. g. flash A/D drivers), especially those requiring fast overdrive recovery times. The limiting function allows the designer to set the maximum and minimum output levels to protect downstream s

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HFA1135IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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HFA1135IBZ Details

  • Manufacturer Part Number:

    HFA1135IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOICN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    16.5 µA

  • Bandwidth (3dB)-Nom:

    360 MHz

  • Bias Current-Max (IIB) @25C:

    15 µA

  • Common-mode Reject Ratio-Min:

    45 dB

  • Common-mode Reject Ratio-Nom:

    48 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1530 V/us

  • Supply Current-Max:

    7.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Wideband:

    YES

  • Width:

    3.9 mm

HFA1135IBZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer.
  • Critical timing parameters include the clock frequency, setup and hold times, and propagation delay. Ensure that these parameters are met by carefully designing the clock tree, using a clock buffer if necessary, and verifying the design with simulation tools.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines, and ensure that the PCB is designed with ESD protection in mind. Also, follow proper handling and storage procedures to prevent ESD damage.
  • The power supplies should be sequenced in the following order: VCC, VDD, and then AVDD. Ensure that the power supplies are stable and within the recommended voltage range before applying clock and input signals.

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HFA1135IBZ Overview

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